News Release

[Event]  April 2, 2008

Exhibit at 【3rd FPD Components & Materials EXPO】

We exhibit to 【3rd FPD Components & Materials EXPO April 16th-18th, 2008 held with Tokyo Big Sight (Japan). Booth No.EAST 39-27】 We will wait for your coming.

3rd FPD Components & Materials EXPO Official Site

Our exhibition product

1. Anisotropic Conductive Film (ACF)
2. Flex-Rigid printed circuit board
3. Flexible printed circuit board
4. Elastic optical resin (Super View Resin)
5. Antireflection film
6. Touch panel
7. Removable type double coated tapes/Low VOC double coated tapes
8. Thermal conductive sheet/Thermal conductive adhesive transfer tapes
9. Adhesive tapes for suitable for securing EMC shilding
10. Thermosetting tapes for FPC/Heat resistance adhesive transfer tapes for FPC
11. PET carrier type double coated tapes/Impact force resistant type double coated tapes/Strong adhesive type double coated tapes
12. Polyester resin base hotmelt transfer tapes (non-carrier type)

Click here for any inquiry about this events