Products

Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized LCDs

Suitable for direct mounting of driver IC which drives a flat panel display onto glass substrate.
With both excellent conductivity and insulating property between terminals for fine pitch connection.


Performance comparison table

Product Name CP6920F CP6920F3 CP30941-20AB
Type COG
Connection material IC
ITO Glass
Minimum space (µm) *1 15 12 13
Minimum pitch (µm) *2 -
Minimum connection area (µm2) *3 1800 1300 1600
Thickness (µm) 20
Conductive particles Type Au/Ni plating on a polymer core particle with insulation
Particle diameter (µmΦ) 4 3 3.5
Insulation coated particle Yes
ACF Laminating conditions Temperature (°C) *4 60 to 80
Time (sec) *5 1 to 2 2 to 3
Pressure (MPa) *6 0.3 to 1.0 0.5 to 1.0
Main bonding conditions Temperature (°C) *4 190 to 230 160 to 280
Time (sec) *5 5
Pressure (MPa) *7 60 to 80 40 to 80
  • *1 Minimum space: Space between neighboring circuits.
  • *2 Minimum pitch: Total length of conductor width and space between neighboring circuits.
  • *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps.
  • *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF.
  • *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target.
  • *6 Pressure of ACF lamination: It is described as the area of ACF lamination.
  • *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.