Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized LCDs
Suitable for direct mounting of driver IC which drives a flat panel display onto glass substrate.
With both excellent conductivity and insulating property between terminals for fine pitch connection.
Products Category Anisotropic Conductive Film (ACF)
Performance comparison table
Product Name
Type COG
Connection material IC
ITO Glass
Minimum space (µm) *1 15 12 13
Minimum pitch (µm) *2 -
Minimum connection area (µm²) *3 1800 1300 1600
Thickness (µm) 20
Conductive particles Type

Au/Ni plating on a polymer core particle with insulation
Particle diameter (µmΦ) 4 3 3.5
Insulating coated particle Yes
ACF Laminating conditions Temperature (°C) *4 60 to 80 
Time (sec) *5 1 to 2  2 to 3
Pressure (MPa) *6 0.3 to 1.0  0.5 to 1.0
Main bonding conditions Temperature (°C) *4 190 to 230 160 to 180
Time (sec) *5 5 
Pressure (MPa) *7 60 to 80  40 to 80
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.