Anisotropic Conductive Film (ACF) for Chip On Board for IC card tags
Designed for connection of IC card or distribution tags and IC chips. Low-temperature and short-time bonding is possible.
Products Category Anisotropic Conductive Film
(ACF)
Performance comparison table
Product Name
Type COB
Connection material IC
FPC
Minimum space (µm) *1 -
Minimum pitch (µm) *2 -
Minimum connection area (µm²) *3 -
Thickness (µm) 15 30
Conductive particles Type

Nickel Particle
Particle diameter (µmΦ) 2
Insulating coated particle NO
ACF Laminating conditions Temperature (°C) *4 60 to 90
Time (sec) *5 1 to 3
Pressure (MPa) *6 0.2 to 0.3
Main bonding conditions Temperature (°C) *4 170 to 180 190 to 210
Time (sec) *5 10 to 5
Pressure (N/Chip) *7 1 to 10
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.