Products

Anisotropic Conductive Film (ACF) for Film On Plastics for Touch panel

Suitable for connection of ITO Plastics and FPC.


Performance comparison table

Product Name CP906AM-25AC CP906CM-25AC
Type FOP
Connection material FPC
ITO Plastics (Ag paste Patterning) / FPC
Minimum space (µm) *1 100 200
Minimum pitch (µm) *2 200 400
Minimum connection area (µm2) *3 -
Thickness (µm) 25
Conductive particles Type Au/Ni plating on a polymer core particle
Particle diameter (µmΦ) 25 25
Insulation coated particle NO
ACF Laminating conditions Temperature (°C) *4 40 to 50
Time (sec) *5 1 to 2
Pressure (MPa) *6 0.5 to 1.5
Main bonding conditions Temperature (°C) *4 140 to 160
Time (sec) *5 10
Pressure (MPa) *7 2 to 4
  • *1 Minimum space: Space between neighboring circuits.
  • *2 Minimum pitch: Total length of conductor width and space between neighboring circuits.
  • *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps.
  • *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF.
  • *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target.
  • *6 Pressure of ACF lamination: It is described as the area of ACF lamination.
  • *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, FOF, and FOP mounting is described as the bonding area.