Anisotropic Conductive Film (ACF) for Film On Glass for small-to-medium-sized LCDs
Suitable for connection of COG-mounted glass substrate and FPC.
Products Category Anisotropic Conductive Film (ACF)
Performance comparison table
Product Name
Type FOG
Connection material ITO Glass
TCP/COF/FPC
Minimum space (µm) *1 30 25
Minimum pitch (µm) *2 70 50
Minimum connection area (µm²) *3 -
Thickness (µm) 25 18
Conductive particles Type Au/Ni plating on a polymer
core particle		 Au/Ni plating on a polymer
core particle with insulation
Particle diameter (µmΦ) 5 4
Insulating coated particle NO Yes
ACF Laminating conditions Temperature (°C) *4 70 to 90
Time (sec) *5 1 to 3
Pressure (MPa) *6 0.5 to 1.5
Main bonding conditions Temperature (°C) *4 170 to 90 165 to 200
Time (sec) *5 15 8
Pressure (MPa) *7 2 to 4
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.