Anisotropic Conductive Film (ACF) for Film On Board / Film for alternative to connector & solder
Suitable for connection of rigid board and film material or connection between film materials.
Products Category Anisotropic Conductive Film
(ACF)
Performance comparison table
Product Name
Type FOB/FOF
Connection material FPC
PWB/FPC
Minimum space (µm) *1 100
Minimum pitch (µm) *2 200
Minimum connection area (µm²) *3 -
Thickness (µm) 35
Conductive particles Type Au-plated Nickel Particle Au/Ni plating on a polymer core particle lead-free solder particle
Particle diameter (µmΦ) 10
Insulating coated particle NO
ACF Laminating conditions Temperature (°C) *4 70 to 90 40 to 50
Time (sec) *5 1 to 3 1 to 2
Pressure (MPa) *6 0.5 to 1.5
Main bonding conditions Temperature (°C) *4 180 to 200 130 to 160
Time (sec) *5 10 6
Pressure (MPa) *7 2 to 4 1 to 4
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.