Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized LCDs
Suitable for direct mounting of driver IC which drives a flat panel display onto glass substrate.
With both excellent conductivity and insulating property between terminals for fine pitch connection.
Products Category Anisotropic Conductive Film (ACF)
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Comparison
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Product Name

 CP30941-20AB

Suitable use

 For small-to-medium-sized LCDs

Application

 AV / Game machines / Cellular phones 
/ Automobiles

Feature
  • Our unique insulating coating technology on a conductive particle takes optimum conductivity in vertical while it completely insulates in horizontal.
  • With an optimum thermal compression, it is possible to interconnect a large number of bumps with fine pitch at a time.
  • The warp of the installation of the IC chip decreases because it bonds with the low temperature from 160°C to 180°C.
  • The 2 layer structure of ACF accommodates adhesive layer and non-conductive layer which efficiently trap conductive particles and compatible for fine pitch application.

Structure
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Specification
Product Name CP30941-20AB
Type COG
Connection material IC
ITO Glass
Minimum space (µm) *1 13
Minimum pitch (µm) *2 -
Minimum connection area (µm²) *3 1600
Thickness (µm) 20
Conductive particles Type Au/Ni plating on a polymer core particle with insulation
Particle diameter (µmΦ) 3.5
Insulation coated particle Yes
ACF Laminating conditions Temperature (°C) *4 60 to 80
Time (sec) *5 2 to 3
Pressure (MPa) *6 0.5 to 1.0
Main bonding conditions Temperature (°C) *4 160 to 180
Time (sec) *5 5
Pressure (MPa) *7 40 to 80
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.

Application Example
Interconnect a small-to-medium-sized LCD and an IC chip.
Application Example Application Example
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caution Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.