Products

Anisotropic Conductive Film (ACF) for Chip On Glass for organic EL panels

For small-to-medium-sized organic EL panel displays and IC chips (COG).


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Product Name

 CP6930JV3

Suitable use

 For small-to-medium-sized organic EL panels

Application
  • AV/
  • Game machines/
  • Cellular phones/
  • Automobiles

Features
  • Conductive particles with excellent performance for bonding oxide-coated metal wiring.
  • Corrosion resistance of CP6930JV3 is superior in COG mounting which fine pitch and high voltage advance to.
  • The 2 layer structure of ACF accommodates adhesive layer and non-conductive layer which efficiently trap conductive particles and compatible for fine pitch application.

Structure

Structure

Specification

Product Name CP6930JV3
Type COG
Connection material IC
ITO Glass
Minimum space (µm) *1 12
Minimum pitch (µm) *2 -
Minimum connection area (µm2) *3 1200
Thickness (µm) 22
Conductive particles Type Ni plating on a polymer core particle with insulation
Particle diameter (µmΦ) 3
Insulation coated particle Yes
ACF Laminating conditions Temperature (°C) *4 60 to 80
Time (sec) *5 1 to 2
Pressure (MPa) *6 0.3 to 1.0
Main bonding conditions Temperature (°C) *4 190 to 230
Time (sec) *5 5
Pressure (MPa) *7 60 to 100
  • *1 Minimum space: Space between neighboring circuits.
  • *2 Minimum pitch: Total length of conductor width and space between neighboring circuits.
  • *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps.
  • *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF.
  • *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target.
  • *6 Pressure of ACF lamination: It is described as the area of ACF lamination.
  • *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.

Application Example

Connection of small-to-medium-sized organic EL panel displays with film.

Application Example
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caution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.