Anisotropic Conductive Film (ACF) for Film On Board / Film for alternative to connector & solder
Suitable for connection of rigid board and film material or connection between film materials.
Products Category Anisotropic Conductive Film
(ACF)
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Comparison
image

Product Name

 CP901AH-35AC

Suitable use

 For alternative to connector and solder

Application

 Computers / AV / Cellular phones

Feature
  • ACF interconnect offers cost reduction by replacing conventional mechanical connectors or soldering interconnect.
  • ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.
  • Our unique solderless lead particle is environmental friendly material (ROHs compliance). It is allows metalic bonding.
  • Bonding at low temperature(130°C to 160°C). Suitable for repair.

Structure
Structure

Specification
Product Name CP901AH-35AC
Type FOB/FOF
Connection material FPC
PWB/FPC
Minimum space (µm) *1 100
Minimum pitch (µm) *2 200
Minimum connection area (µm²) *3 -
Thickness (µm) 35
Conductive particles Type lead-free solder particle
Particle diameter (µmΦ) 10
Insulation coated particle NO
ACF Laminating conditions Temperature (°C) *4 40 to 50
Time (sec) *5 1 to 2
Pressure (MPa) *6 0.5 to 1.5
Main bonding conditions Temperature (°C) *4 130 to 160
Time (sec) *5 6
Pressure (MPa) *7 1 to 4
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.

Application Example
Replacing connectors / soldering interconnect.
Application Example
   Application Example
 
Application Example
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caution Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.