Anisotropic Conductive Film (ACF) for Film On Board for large LCDs
Suitable for connection of TCP or COF and input boards (FOB) for large-sized LCDs.
Please select the product name :
- CP9042KSV/CP20531-35AG

| CP9042KSV/CP20531-35AG | |
| For large LCDs | |
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| Product Name | CP9042KSV | CP20531-35AG | |
|---|---|---|---|
| Type | FOB | FOB | |
| Connection material | PWB | PWB | |
| TCP/COF | COF | ||
| Minimum space (µm) *1 | 100 | 100 | |
| Minimum pitch (µm) *2 | 200 | 200 | |
| Minimum connection area (µm2) *3 | - | - | |
| Thickness (µm) | 35 | 35 | |
| Conductive particles | Type | Au-plated Nickel Particle | Au-plated Nickel Particle |
| Particle diameter (µmΦ) | 3 | 3 | |
| Insulation coated particle | NO | NO | |
| ACF Laminating conditions | Temperature (°C) *4 | 70 to 90 | 70 to 90 |
| Time (sec) *5 | 2 | 2 | |
| Pressure (MPa) *6 | 1 to 1.5 | 0.5 to 1.5 | |
| Main bonding conditions | Temperature (°C) *4 | 180 to 200 | 150 to 170 |
| Time (sec) *5 | 10 | 5 | |
| Pressure (MPa) *7 | 2 to 4 | 3 to 5 | |
- *1 Minimum space: Space between neighboring circuits.
- *2 Minimum pitch: Total length of conductor width and space between neighboring circuits.
- *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps.
- *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF.
- *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target.
- *6 Pressure of ACF lamination: It is described as the area of ACF lamination.
- *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.
Connection of large LCDs with riged printed board and films.

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
