For small-to-medium-sized LCDs
/ For small-to-medium-sized organic EL panels
AV / Game machines / Cellular phones
/ Automobiles
Our unique insulating coating technology on a conductive particle takes optimum conductivity in vertical while it completely insulates in horizontal. Suitable for the fine pitch connection.
With an optimum thermal compression, it is possible to interconnect a large number of bumps with fine pitch at a time.
A proprietary adhesive composition with excellent performance for bonding 2 or 3 layer FPCs.
Suitable for fine-pitched connections, e.g. of a driver IC on a flexible printed circuit board.
Product Name
FP1708E
Type
COF
Connection material
IC
FPC
Minimum space (µm) *1
-
Minimum pitch (µm) *2
-
Minimum connection area (µm²) *3
-
Thickness (µm)
35
Conductive particles
Type
Au/Ni plating on a polymer core particle with insulation
Particle diameter (µmΦ)
3.5
Insulation coated particle
Yes
ACF Laminating conditions
Temperature (°C) *4
60 to 90
Time (sec) *5
0.2 to 3
Pressure (MPa) *6
0.2 to 0.3
Main bonding conditions
Temperature (°C) *4
190
210
Time (sec) *5
10
7
Pressure (N/Bump) *7
0.2 to 0.8
Connection of the driver IC of small-to-medium-sized LCDs with film.
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.