Anisotropic Conductive Film (ACF) for Chip On Film for Camera modules
Suitable for connection of CCD and CMOS camera modules.
Products Category Anisotropic Conductive Film (ACF)
Please select the product name :  
image

Product Name

 FP1830VS

Suitable use

 For CCD and CMOS camera modules

Application

 Computers / AV / Cellular phones

Feature
  • Our unique insulating coating technology on a conductive particle takes optimum conductivity in vertical while it completely insulates in horizontal. Suitable for the fine pitch connection.
  • With an optimum thermal compression, it is possible to interconnect a large number of bumps with fine pitch at a time.
  • Suitable for fine-pitched connections, e.g. of CCD and CMOS image sensor on a flexible printed circuit board.

Structure
Structure
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Specification
Product Name FP1830VS
Type COF
Connection material IC
FPC/COF
Minimum space (µm) *1 20
Minimum pitch (µm) *2 50
Minimum connection area (µm²) *3 -
Thickness (µm) 40
Conductive particles Type Au/Ni plating on a polymer core particle with insulation
Particle diameter (µmΦ) 5
Insulation coated particle Yes
ACF Laminating conditions Temperature (°C) *4 60 to 80
Time (sec) *5 1 to 3
Pressure (MPa) *6 0.2 to 0.3
Main bonding conditions Temperature (°C) *4 190 to 210 220 to 240
Time (sec) *5 10 5
Pressure (N/Chip) *7 0.2 to 1.0
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.

Application Example
Connection of IC chips and FPC films.
Application Example
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caution Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.