Anisotropic Conductive Film (ACF) for Chip On Board for IC card tags
Designed for connection of IC card or distribution tags and IC chips. Low-temperature and short-time bonding is possible.
Products Category Anisotropic Conductive Film
(ACF)
Please select the product name :
Comparison
image

Product Name

 FP2622A

Suitable use

 IC cards, Tags, Smart cards

Application

 Logistics

Feature
  • Our unique insulating coating technology on a conductive particle takes optimum conductivity in vertical while it completely insulates in horizontal.
  • With an optimum thermal compression, it is possible to interconnect a large number of bumps with fine pitch at a time.
  • Conductive particles with excellent performance for bonding oxide-coated metal wiring.
  • Suitable for IC bonding on PET substrate based aluminum antenna with adhesion.

Structure
Structure

Specification
Product Name FP2622A
Type COB
Connection material IC
FPC
Minimum space (µm) *1 -
Minimum pitch (µm) *2 -
Minimum connection area (µm²) *3 -
Thickness (µm) 15
Conductive particles Type Nickel Particle
Particle diameter (µmΦ) 2
Insulation coated particle NO
ACF Laminating conditions Temperature (°C) *4 60 to 90
Time (sec) *5 1 to 3
Pressure (MPa) *6 0.2 to 0.3
Main bonding conditions Temperature (°C) *4 170 to 180
Time (sec) *5 10 to 5
Pressure (N/Chip) *7 1 to 10
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.

Application Example
Interconnect IC chips onto Antenna substrate for smart cards or tags for RFID systems.
Application Example
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caution Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.