Anisotropic Conductive Film (ACF) for Chip On Board for IC chip package
IC chip mounted board enables simultaneous electric connecting and sealing.
Products Category Anisotropic Conductive Film
(ACF)
Please select the product name :  
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Product Name

 FP5530DF

Suitable use

 For IC chip package

Application

 Game machines / Cellular phones

Feature
  • Our unique insulating coating technology on a conductive particle takes optimum conductivity in vertical while it completely insulates in horizontal. Suitable for the fine pitch connection.
  • With an optimum thermal compression, it is possible to interconnect a large number of bumps with fine pitch at a time.
  • No-Flow underfill process, because enables simultaneous electric connecting and sealing.
  • Proprietary adhesive composition with high heat resistance, enhancing reliability under lead-free reflow.
 

Structure
Structure

Specification
Product Name FP5530DF
Type COB
Connection material IC
PWB
Minimum space (µm) *1 20
Minimum pitch (µm) *2 50
Minimum connection area (µm²) *3 -
Thickness (µm) 50
Conductive particles Type Au/Ni plating on a polymer core particle with insulation
Particle diameter (µmΦ) 5
Insulation coated particle Yes
ACF Laminating conditions Temperature (°C) *4 50 to 70
Time (sec) *5 1 to 3
Pressure (MPa) *6 0.2 to 0.3
Main bonding conditions Temperature (°C) *4 180 to 210
Time (sec) *5 20 to 10
Pressure (N/Bump) *7 0.2 to 1.0
*1 Minimum space: Space between neighboring circuits. *2 Minimum pitch: Total length of conductor width and space between neighboring circuits. *3 Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps. *4 Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF. *5 Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target. *6 Pressure of ACF lamination: It is described as the area of ACF lamination. *7 Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.

Application Example
Connection of IC chip and boards.
Application Example
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caution Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.