Thermosetting tapes for FPC
Suitable for fixing of stiffeners(PI, PET, glass epoxy, etc.) and terminals and possible for short-time curing.
Double coated tapes
Please select the product name :  
D3410

Product name

 D3410

Suitable use

 Fixing of FPC reinforcement.

Application

 Computers / AV / Cellular phones

Features
  • Highly adhesive to polyimide or glass epoxy surfaces.
  • Storable at RT.
  • Suitable for thermocompression, quick compression and oven baking processes.
  • Short-time, low-temperature curing possible.
  • Halogen-free.
   

Structure

Specifications
Product name D3410
Main component NBR/epoxy
Carrier Non-carrier
Color Brown
Adhesive thickness(µm) About 35
Release paper thickness (µm) About 110+38
Bonding strength(N/10mm) 17.72 or higher
St'd size (width & length) 500mm x 100m

Recommended setting condition:

  1. Quick compression (160 °C, 1 to 2 min, 49 N/cm²) >> Oven curing (80 °C, 30 min + 160 °C, 1 hr)
  2. Compression (160 °C, 60 min, 98 N/cm²)

Application Example

For fixing of reinforcements, such as PI, PET and glass epoxy, or terminals to FPC which experience a heat profile such as solder reflow.
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Technical Data
1.90°Peeling strength (Polyimide/glass epoxy) 90° peeling strength test
Test Piece Condition
Substrate: Polyimide/Glass Epoxy
Tape width: 20mm
Bonding condition : Quick compression (160 °C, 1 to 2 min, 49 N/cm²) >> Oven curing (80 °C, 30 min + 160 °C, 1 hr)
Peel speed: 50mm/min
 
Results

12  N/10mm
2.Solder resistance  
Test Piece Condition
  • Immersed in a solder bath at 260°C for one minute.
    *Recommend conducting baking for foam inhibition before solder reflow.
  • Recommended baking condition: 100°C,60min.
    Condition for leaving test specimens at stand before solder reflow: 23°C,65%RH, less than 3 hrs
Results

No change found
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caution The technical data in this document, which was acquired based on reliable tests, does not guarantee full performance as per the documentation in any instance. Users assume total responsibility and risk for use of this product for any purpose under any usage conditions.