Products

Thermosetting tapes for FPC

Thermosetting tapes suitable for fixing of backing materials and terminals.


Comparison

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Product name

 D3410/D3411

Suitable use

 Fixing of FPC reinforcement

Application
  • Computers/
  • AV/
  • Game machines/
  • Cellular phones

Features
  • Highly adhesive to polyimide or glass epoxy surfaces.
  • Storage at room temperatures; easy handling.
  • Shortens processing time. Ideal for fixing hot press, quick press, and oven-curing.
  • Short-time curing with low-temperature.

Structure

Structure

Specifications

Product name D3410 D3411
Main component NBR/Epoxy base NBR/Epoxy base
Carrier Non-carrier Non-carrier
Color Light yellow Light yellow
Adhesive thickness(µm) About 35 About 25
Release film thickness (µm) About 38 About 38
Release paper thickness (µm) About 115 About 115
Bonding strength(N/10mm) *1 14 12
St'd size(width & length) 500mm x 100m 500mm x 100m
Warranty period from manufacturing date 9 months 9 months
*1 90 peeling strength to polyimide
* Recommended curing conditions:
  1. Quick press(Temperature / 130°C to 160°C, Time / 1 min to 2 min, Pressure / 0.5MPa) →Oven curing(30 min at 80°C + 60 min at 160°C)
  2. Press(160°C, 60 min, 1MPa)

Application Example

Application Example
Ideal for fixing FPC stiffeners and other materials that undergo heat treatment(e.g., solder reflow).

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Technical Data

1.Bonding strength on various type of substrate (90° peeling strength)


Test Piece condition
Substrate: Polyimide / Glass epoxy
Tape width: 10mm
Bonding condition : * Recommended curing conditions listed above
Peeling speed: 50mm/min
Backing material: CCL(=Copper Clad Laminate)
Results
(N/10mm)
90° peeling strength Product name Long press Vacuum quick press and post cure
CCL/GE CCL/
Polyimide		 CCL/GE CCL/
Polyimide
D3410 21 15 20 14
D3411 17 13 17 12

2.Solder reflow process heat resistance


Test Piece condition
Constitution: Polyimide film
Tape width: 10mm
Bonding condition : * Recommended curing conditions listed above
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 50mm/min
Backing material: CCL(=Copper Clad Laminate)
* Solder reflow condition: Refer to the solder reflow profile chart
  • [Left at RT for one hour before measurement]
Results
Solder reflow process heat resistance Product name Long press Vacuum quick press and post cure
Treatment before reflow: Dry Treatment before reflow: Dry
1/100/- * 1/100/- *
D3410 260°C pass 260°C pass
D3411 260°C pass 260°C pass
* Treatment condition: process time (h) / temperature(°C) / humidity(%)
Results
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coution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.