Products

Special resin base hotmelt double coated tapes

For applications where strong adhesiveness is required, such as mutual adhesion of metal materials, and adhesion of a metal material and a plastic material.


Comparison

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Product name

 D3615T

Suitable use

 Adhesion of Aluminum name plates, and metal and plastic materials

Application
  • Computers/
  • AV/
  • Game machines/
  • Cellular phones

Features
  • Fills cavities and clearances for strong bonding in hot melting processes. Minimal projection.
  • The tape is tack-free at room temperature, enabling punching and spinning without release paper.

Structure

Structure

Specifications

Product name D3615T
Main component Polyester base
Carrier Nonwoven fabric
Color Translucent white
Adhesive thickness(µm) about 150
Release paper thickness(µm) About 60
Bonding strength
(N/20mm x 20mm) *1		 2,200
St'd size(width & length) 460mm x 50m
Warranty period from manufacturing date 12 months

*1 Shear strength (Bonding at 150°C)
Recommended bonding conditions: Temperature / 120°C to 150°C, Time / 3 sec to 10 sec, Pressure / 0.5MPa or higher


Application Example

Application Example
Ideal for bonding plastics and metals.

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Technical Data

1.Bonding strength at different temperature (Shear strength)


Test Piece condition
Substrate(1) : Stainless steel plate 0.5mm x 25mm x 100mm
Substrate(2): PC , ABS plate 2mm x 25mm x 100mm
Bonding area: 20mm x 20mm
Bonding condition:

Temperaturele 100°C to 200°C / Time 3 sec / Pressure 0.5MPa(5kgf/cm2)
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 20mm/min
  • [Left at RT for one day before measurement]

Results
(N/20mm x 20mm)
Shear strength Bonding temperature D3615T
100°C 471.0 AF
110°C 529.5 AF
120°C 1,240.6 AF
130°C 1,706.4 AF
140°C 2,265.3 *
150°C 2,206.5 *
160°C 2,196.7 *
170°C 2,186.9 *
180°C 2,201.6 *
190°C 2,255.5 *
200°C 2,255.5 *

Adhesion failure from SUS + Cohesion failure(SUS AF+CF)
* Delamination

Results

2.Bonding strength at different temperature (Push out test)


Test Piece condition
Substrate(1): Stainless steel plate 1.0mm x 50mm x 100mm
Substrate(2): PC , ABS plate 2mm x 38mm x 64mm
Bonding area: 2mm x 35mm / 2pieces
Bonding condition:

Temperature 100°C to 150°C / Time 3 sec / Pressure 0.5MPa(5kgf/cm2)
Measuring condition: 23°C±5°C 60%±20%RH
Push speed: 10mm/min
  • [Left at RT for one day before measurement]

Results
(N/1.4cm2)
Push out test Bonding temperature D3615T
100°C 367.9
110°C 500 or less
120°C 500 or less
130°C 500 or less
140°C 500 or less
150°C 500 or less

3.Impact force resistance at different temperature (Drop test)


Test Piece condition
Substrate(1): Stainless steel plate 1.0mm x 50mm x 100mm
Substrate(2): PC , ABS plate 2mm x 50mm x 100mm
Bonding area: 10mm x 10mm
Bonding condition:

Temperature 100°C to 150°C / Time 3 sec / Pressure 0.5MPa(5kgf/cm2)
Measuring condition: 23°C±5°C 60%±20%RH
Height: 1.5m
Weight: 300g
  • [Left at RT for one day before measurement]
  • [The test piece is dropped to concrete.Record the numbers when the test piece peel off]

Results
Impact force resistance
(Drop test)		 Bonding temperature D3615T
100°C 28
110°C 46
120°C 50 or less
130°C 50 or less
140°C 50 or less
150°C 50 or less
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coution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.