Products

Heat resistant adhesive transfer tapes for FPC

Double coated tapes for fixing FPC stiffener.


Please select the product name :



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Product Name

 G4200D/G4200DW

Suitable use

 For FPCs.

Application
  • Computers/
  • AV/
  • Cellular phones/

Features
  • Environmentally friendly non-solvent manufacturing method.
  • Highly adhesive to FPC backing materials (PET, polyimide and metal).
  • Resistant to high-temperature conditions for lead free solder reflow. Little degradation of adhesive and release paper after reflow.
  • High holding power even at high temperature.
  • High processability and workability.
non-solvent manufacturing method

Structure

Structure

Specifications

Product Name G4200D G4200DW((*2)
Main component Acrylic base Acrylic base
Carrier Non-carrier Non-carrier
Color Semi transparent Semi transparent
Adhesive thickness(µm) 50 50
Release paper thickness(µm) 95 95+130
Bonding strength(N/20mm) 10 10
St'd size(width & length) 500mm x 100m 500mm x 100m

*2 G4200DW: With both side release paper.


Application Example

For fixing of FPC main body or adhesion of reinforcement.

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Technical Data

1.Bonding strength on various type of substrate (180° peeling)


Test Piece condition
Tape width: 20mm
Bonding condition One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peel speed: 300mm/min
Backing material: 25 µm PET
  • [Left at RT for one hour before measurement]
Results
Results

2.Peeling strength before and after reflow


Test Piece condition
  • Attach adhesive tape to polyimide (kapton® 111H) and reflow without removing release paper before measurement under the following conditions.
  • For reflow conditions, see the reflow graph (maximum temperature: 240°C)
Substrate: Glass epoxy
Tape width: 20mm
Bonding condition: One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peel speed: 300mm/min
  • [Left at RT for one hour before measurement]
Results
Results

3.Peeling strength of release paper before and after reflow (T-type peeling and appearance of release paper)


Test Piece condition
Pretreatment: Reflow release paper/adhesive/kapton® 100H before measurement.
Measuring condition: 23°C±5°C 60%±20%RH
Peel speed: 300mm/min
Results
Results
Results

4.Holding Power at different temperatures


Test Piece condition
Substrate: Stainless steel plate (SUS304)
Bonding area: 25mm x 25mm
Bonding condition: One stroke with 2-kg roller
Backing material: 25µm PET
  • [Left at RT for one hour and then at each temperature for 30 minutes before measurement]
  • [Creep length after one hour application of 1-kg load]
Results
Results

5.Punching processes


Test Piece condition
Blade type: Pinnacle type
Cutting type: Half cutting
Results
  G4200D
2000 shots No adhesive left on blade
3000 shots No adhesive left on blade
5000 shots No adhesive left on blade
  Photograph of appearance after 5000 shots
Photograph of appearance after 5000 shots
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coution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.