Products

Adhesive transfer tapes for FPC

Excellent for reflow process, and high processability.


Comparison

Please select the product name :


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Product name

 G4200D/G4200DW

Suitable use

 For FPCs

Application
  • Computers/
  • AV/
  • Game machines/
  • Cellular phones

Features
  • No solvent used at coating process. UV curable manufacturing method.
  • Both adhesive and release paper resist heat deterioration during the reflow process(Top:260°C).
  • Excellent workability for punching and bonding.
  • Ideal for bonding FPC materials such as polyimide, stainless steel, glass epoxies, etc.
Green tape

Structure

Structure

Specifications

Product name G4200D G4200DW *2
Main component Acrylic base Acrylic base
Carrier Non-carrier Non-carrier
Color Translucent Translucent
Adhesive thickness(µm) About 50 About 50
Release paper thickness(µm) About 95 About 95+130
Bonding strength(N/20mm) *1 9 9
St'd size(width & length) 500mm x 100m 500mm x 100m
Warranty period from manufacturing date 9 months 9 months

*1 180° peeling strength to polyimide
*2 G4200DW: With both side release paper.


Application Example

Ideal for fixing FPC and stiffeners for FPC.

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Technical Data

1.Bonding strength on various type of substrate (180° peeling)


Test Piece condition
Tape width: 20mm
Bonding condition One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm PET
  • [Left at RT for one hour before measurement]
Results
Results

2.Bonding strength before and after lead free reflow process (180° peeling)


Test Piece condition
Tape width: 20mm
Bonding condition: One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm PET
  • [Left at RT for one hour before measurement]
  • [Attach adhesive tape to polyimide or glass epoxy and reflow without removing release paper before measurement under the following conditions]
Results
(N/20mm)
180° peeling strength Product name Measuring condition Substrate
PI GE
G4200D Before reflow 9 10
After reflow 10 10
Results

3.Bonding strength of release paper before and after reflow(T-type peeling)


Test Piece condition
Tape width: 50mm
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm polyimide
  • [Left at RT for one hour before measurement]
  • [Attach adhesive tape to polyimide and reflow without removing release paper before measurement under the following conditions]
Results
(N/50mm)
T-type peeling strength Product name Measuring condition
Before reflow After reflow
G4200D 0.3 0.3

4.Holding power at different temperatures


Test Piece condition
Substrate: Stainless steel plate (SUS304)
Bonding area: 25mm x 25mm
Bonding condition: One stroke with 2-kg roller
Backing material: 25µm PET
  • [Left at RT for one hour and then at each temperature for 30 minutes before measurement]
  • [Creep length after one hour application of 1-kg load]
Results
Creep length(mm) Product name Measurement temperature
80°C 120°C
G4200D 0.1 0.2
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coution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.