Products

Special resin base hotmelt double coated tapes

For applications where strong adhesiveness is required, such as mutual adhesion of metal materials, and adhesion of a metal material and a plastic material.


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Product name

 NP605

Suitable use

 Adhesion of Aluminum name plates, and metal and plastic materials

Application
  • Computers/
  • AV/
  • Game machines/
  • Cellular phones

Features
  • The tape is tack-free at room temperature, enabling punching and spinning without release paper.
  • Low-temperature heat activation type enables bonding at 90°C.

Structure

Structure

Specifications

Product name NP605
Main component Special resin base
Carrier Nonwoven fabric
Color Translucent white
Adhesive thickness(µm) About 85
Release paper thickness(µm) About 60
Bonding strength
(N/40mm x 40mm) *1		 250
St'd size(width & length) 400mm x 100m
Warranty period from manufacturing date 12 months

*1 Cleavage strength to Aluminum / Polystyrene
Recommended bonding conditions: Temperature / 100°C to 140°C, Time / 8 sec to 15 sec, Pressure / 0.2MPa to 0.3MPa


Application Example

Application Example
For adhesion of Aluminum name plates, and metal and plastic materials.

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Technical Data

1.Bonding strength on various bonding temperatures (Cleavage strength)


Test Piece condition
Substrate: Aluminum plate(t=0.4mm) / Polystyrene plate(t=5mm)
Bonding area: 40mm x 40mm
Bonding condition: Temperature 90°C to 140°C / Time 10 sec / Pressure 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed 20mm/min
  • [Left at RT for one hour before measurement]
Results
Results

2.Reliability of bonding strength under different conditions (Cleavage strength)


Test Piece condition
Substrate: Aluminum plate(t=0.4mm) / Polystyrene plate(t=5mm)
Bonding area: 40mm x 40mm
Bonding condition: Temperature 90°C to 140°C / Time 10 sec / Pressure 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed : 20mm/min
  • [Left at RT for one hour before measurement]
Results
Results

3.Bonding strength at different temperatures (Cleavage strength)


Test Piece condition
Substrate: Aluminum plate (t=0.4mm) / Polystyrene plate (t=5mm)
Bonding area: 40mm x 40mm
Bonding condition: Temperature 120°C / Time 10 sec / Pressure 0.3MPa
Peeling speed 20mm/min
  • [Left at RT for one hour and then at each temperature for 30 minutes before measurement]
Results
Results

4.Shear strength at different temperatures


Test Piece condition
Substrate: Stainless steel plate (t=0.5mm) / PC, ABS plate (t=5mm)
Bonding area: 20mm x 20mm
Bonding condition: Temperature 90°C to 150°C / Time 10 sec / Pressure 0.3MPa
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed : 20mm/min
  • [Left at RT for one day before measurement]
Results
Results
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coution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.