NP605 | Thermal Special resin-base hotmelt adhesive tapes | Double coated tapes | Products | Sony Chemical & Information Device Corporation



	General-purposedouble coated tapes Removable typedouble coated tapes Impact force resistant typedouble coated tapes Strong adhesive typedouble coated tapes Flame retardant typedouble coated tapes Special resin-base hotmelt adhesive tapes Double coated tapesfor LCD modules PET carrier typedouble coated tapes Strong glass meshcarrier type double coated tapes Adhesive transfer tapes Adhesive transfer tapesfor FPC Heat resistantadhesive transfer tapes for FPC Adhesive transfer tapesfor FPC & general-purpose Low outgasadhesive transfer tapes Strong adhesivetransfer tapes Nitrile rubber base hotmelt adhesive tapes(non-carrier type)Special resin-basehotmelt adhesive tapes(non-carrier type)Thermosetting tapes for FPC Polyester resinbase hotmelt adhesive tapes(non-carrier type)Conductive adhesivetransfer tapes Thermal conductiveadhesive transfer tapes

		Special resin-base hotmelt adhesive tapes
		For applications where strong adhesiveness is required, such as mutual adhesion of metal materials, and adhesion of a metal material and a plastic material.

Double coated tapes

Please select the product name :
NP605 NP608

	NP605


	Adhesion of Aluminum name plates, and metal and plastic materials.


	Computers / AV / Cellular phones / Automobiles


	Punching and drawing possible after lamination to materials such as Aluminum and removal of release paper. Activate at low temperature.

Product name	NP605
Main component	Special resin-base
Carrier	Nonwoven fabric
Color	White turbidity
Adhesive thickness(µm)	About 85
Release paper thickness(µm)	About 60
Bonding strength(N/40mm)	275
St'd size (width & length)	400mm x 100m
Standard bonding condition	Temperature: 100 to 140°C, Time: 8 to 15 sec, Pressure: 20 to 30 N/cm²




			For adhesion of Aluminum name plates, and metal and plastic materials.



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1.Bonding strength under different temperatures (Cleavage strength)

Cleavage test method

Test Piece Condition

Substrate:	500 µm Aluminum/5 mm polystyrene
Bonding area:	20mm
Bonding condition:	Pressure: 30 N/cm², Time: 10 sec
Peeling speed	20mm/min

[Left at each test temperature for 30 minutes before measurement]

Results

2.Bonding strength at different temperatures (90° peeling)

90° peeling strength test

Test Piece Condition

Substrate:	40µm Aluminum/5 mm polystyrene
Tape width :	20mm
Bonding condition:	Temperature: 120° Pressure: 30 N/cm² Time: 10 sec
Peeling speed	300mm/min

[Left at each test temperature for 30 minutes before measurement]

Results

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The technical data in this document, which was acquired based on reliable tests, does not guarantee full performance as per the documentation in any instance. Users assume total responsibility and risk for use of this product for any purpose under any usage conditions.