Special resin base hotmelt adhesive tapes
For applications where strong adhesiveness is required, such as mutual adhesion of metal materials, and adhesion of a metal material and a plastic material.
Please select the product name :
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NP608 |
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Adhesion of Aluminum name plates, and metal and plastic materials |
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- Computers/
- AV/
- Cellular phones
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|
- Punching and drawing possible after lamination to materials such as Aluminum and removal of release paper.
- Low-temperature heat activation type enables bonding at 90°C.
- The tape is tack-free at room temperature, enabling punching and spinning without release paper.
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| Product name |
NP608 |
| Main component |
Special resin base |
| Carrier |
Non-carrier |
| Color |
Translucent white |
| Adhesive thickness(µm) |
About 50 |
| Release paper thickness(µm) |
About 60 |
| Bonding strength(N/40mm x 40mm) *1 |
240 |
| St'd size(width & length) |
400mm x 100m |
| Warranty period from manufacturing date |
12 months |
*1 Cleavage strength to aluminum foil/ABS
Recommended bonding condition: Temperature / 100°C to 140°C, Time / 8 sec to 15 sec, Pressure / 0.2MPa to 0.3MPa
Ideal for bonding plastics and metals.
1.Bonding strength at different temperatures (180° peeling)
| Substrate: |
ABS plate |
| Tape width: |
20mm |
| Bonding condition: |
Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa |
| Measuring condition: |
23°C±5°C 60%±20%RH |
| Peeling speed: |
100mm/min |
| Backing material: |
50µm aluminum foil |
- [Left at RT for 30 minutes and then at each temperature for 30 minutes before measurement]
2.Bonding strength at different temperatures (Cleavage strength)
| Substrate: |
Aluminum plate (t=0.4mm) / ABS plate (t=5mm) |
| Bonding area: |
40mm x 40mm |
| Bonding condition: |
Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa |
| Measuring condition: |
23°C±5°C 60%±20%RH |
| Peeling speed: |
20mm/min |
- [Left at RT for one day and then at each temperature for 30 minutes before measurement]
3.Reliability of bonding strength under different conditions (Cleavage strength)
| Substrate: |
Aluminum plate (t=0.4mm) / ABS plate (t=5mm) |
| Bonding area: |
40mm x 40mm |
| Bonding condition: |
Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa |
| Measuring condition: |
23°C±5°C 60%±20%RH |
| Peeling speed: |
20mm/min |
- [Left at RT for one day and then at each temperature for 30 minutes before measurement]
4.Initial Bonding strength against different types of substrate (Cleavage strength)
| Substrate: |
Aluminum plate (t=0.4mm) / ABS plate (t=5mm) |
| Bonding area: |
40mm x 40mm |
| Bonding condition: |
Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa |
| Measuring condition: |
23°C±5°C 60%±20%RH |
| Peeling speed: |
20mm/min |
- [Left at RT for one day and then at each temperature for 30 minutes before measurement]
5.Bonding strength at different bonding temperatures(Cleavage strength)
| Substrate: |
Aluminum plate (t=0.4mm) / ABS plate (t=5mm) |
| Bonding area: |
40mm x 40mm |
| Bonding condition: |
Temperature / 120°C, Time / 10sec, Pressure / 0.3MPa |
| Measuring condition: |
23°C±5°C 60%±20%RH |
| Peeling speed: |
20mm/min |
- [Left at RT for one day and then at each temperature for 30 minutes before measurement]
6.Shear strength at different temperatures
| Substrate: |
SUS plate (t=0.5mm) / PC, ABS plate (t=5mm) |
| Bonding area: |
20mm x 20mm |
| Bonding condition: |
Temperature / 90°C to 150°C, Time / 10sec, Pressure / 0.3MPa |
| Measuring condition: |
23°C±5°C 60%±20%RH |
| Peeling speed: |
20mm/min |
- [Left at RT for one day before measurement]
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.
