Products

Adhesive transfer tapes for FPC

Excellent for reflow process, and high processability.


Comparison

Please select the product name :



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Product name

 T4100/T4100W/T4103

Suitable use

 For general-purpose, and fixing of FPC reinforcement

Application
  • Computers/
  • AV/
  • Game machines/
  • Cellular phones

Features
  • Ideal for fixing FPC stiffeners materials( PET, polyimide, and metal).
  • Resistant to high temperature of solder reflow(Top:230°C). Both adhesive and release paper resist heat deterioration during the reflow process.
  • T4103 is thinner version of T4100.

Structure

Structure

Specifications

Product name T4100 T4100W *2 T4103
Main component Acrylic base Acrylic base Acrylic base
Carrier Non-carrier Non-carrier Non-carrier
Color Translucent Translucent Translucent
Adhesive thickness(µm) About 50 About 50 About 25
Release paper thickness(µm) About 100 About100 + 110 About 100
Bonding strength(N/20mm) *1 9 9 7
St'd size(width & length) 500mm x 100m 500mm x 100m 500mm x 100m
Warranty period from manufacturing date 12 months 12 months 12 months

*1 180° peeling strength to polyimide
*2 T4100W: With both side release paper


Application Example

Application Example
Ideal for fixing FPC stiffeners materials.

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Technical Data

1.Bonding strength (180° peeling)


Test Piece condition
Substrate: Polyimide
Tape width: 20mm
Bonding condition: One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm PET
  • [Left at RT for one hour before measurement]
Results
(N/20mm)
180° peeling strength Product name Bonding strength
G4100 9
G4103 7

2.Bonding strength before and after reflow (180° peeling)


Test Piece condition
Substrate: Polyimide
Tape width: 20mm
Bonding condition: One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm polyimide
  • [Attach adhesive tape to polyimide and reflow without removing release paper before measurement under the following conditions]
Results
(N/20mm)
180° peeling strength Product name Measuring condition
Before reflow After reflow
T4100 9 9
T4103 7 7
Results

3.Holding power at different temperatures


Test Piece condition
Substrate: Stainless steel plate (SUS304)
Bonding area: 25mm x 25mm
Bonding condition: One stroke with 2-kg roller
Backing material: 25µm polyimide
  • [Left at RT for one hour and then at each temperature for 30 minutes before measurement]
  • [Creep length after one hour application of 1-kg load]
Results
Creep length(mm) Product name Measurement temperature
23°C 40°C 60°C 80°C 100°C
T4100 0 0.1 0.3 0.5 0.6
T4103 0 0 0.2 0.3 0.3
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coution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.