Products

Adhesive transfer tapes for FPC

Excellent for reflow process, and high processability.


Comparison

Please select the product name :


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Product name

 T4900/T4900W

Suitable use

 For general-purpose, and fixing of FPC reinforcement/equipment body

Application
  • Computers/
  • AV/
  • Game machines/
  • Cellular phones/
  • Automobile

Features
  • Ideal for fixing FPC stiffeners materials( PET, polyimide, and metal).
  • Resistant to high temperature of solder reflow(Top:230°C). Both adhesive And release paper resist heat deterioration during the reflow process. Low outgassing.
  • Low-tack design ensures excellent processability and workability for bonding.

* Succeeding model of T4100/T4100W
Green tape

Structure

Structure

Specifications

Product name T4900 T4900W *2
Main component Acrylic base Acrylic base
Carrier Non-carrier Non-carrier
Color Translucent Translucent
Adhesive thickness(µm) About 50 About 50
Release paper thickness(µm) About 90 About 90+130
Bonding strength(N/20mm) *1 9 9
St'd size(width & length) 500mm x 100m 500mm x 100m
Warranty period from manufacturing date 12 months 12 months

UL certificated. UL file No:(UL969 No.MH15431)
*1 180° peeling strength to polyimide
*2 T4900W: With both side release paper.


Application Example

Application Example
Ideal for fixing FPC and stiffeners for FPC.

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Technical Data

1.Bonding strength on various type of substrate (180° peeling)


Test Piece condition
Tape width: 20mm
Bonding condition One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm PET
  • [Left at RT for one hour before measurement]
Results
(N/20mm)
180° peeling strength Product name Substrate
PI GE SUS AL PET ABS
T4900 8 9 9 9 9 8

2.Bonding strength on various type of substrate after reflow (180° peeling)


Test Piece condition
Tape width: 20mm
Bonding condition: One stroke with 2-kg roller
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed : 300mm/min
Backing material: 25µm polyimide
  • [Attach adhesive tape to polyimide and reflow without removing release paper before measurement under the following conditions]
Results
(N/20mm)
180° peeling strength Product name Measuring condition Substrate
PI GE SUS AL PET ABS
T4900 Before reflow 8 9 9 9 9 8
After reflow 9 9 9 9 9 8
試験結果

3.Bonding strength of release paper before and after reflow (T-type peeling)


Test Piece condition
Tape width: 50mm
Measuring condition: 23°C±5°C 60%±20%RH
Peeling speed: 300mm/min
Backing material: 25µm polyimide
  • [Reflow release paper / adhesive / polyimide film before measurement]
Results
(N/50mm)
T-type peeling strength Product name Measuring condition:
Before reflow After reflow
T4900 0.2 0.3

4.Holding power at different temperatures


Test Piece condition
Substrate: Stainless steel plate (SUS304)
Bonding area: 25mm x 25mm
Bonding condition: One stroke with 2-kg roller
Backing material: 25µm polyimide
  • [Left at RT for one hour and then at each temperature for 30 minutes before measurement]
  • [Creep length after one hour application of 1-kg load]
Results
Creep length(mm) Product name Measurement temperature
80°C 120°C
T4900 0.2 0.3
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coution
Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.