Conductive adhesive coated on 35 µm electrolysis copper foil. Less than about one-tenth the conductive resistance of our existing products.
Product Name
CU7636D
Main component
Acrylic base
Carrier
35 µm electrolysis copper foil
Color
Copper
Adhesive thickness(µm)
About 70
Release paper thickness(µm)
About 115
Bonding strength(N/20mm)
8
St'd size (width & length)
500mm x 25m
Shields and photothermal reflection for digital devices such as cellular phones, PDAs, digital still cameras, camcorders, computers, and game machines.
Shielding effects of the product under a magnetic or electric field were measured using a device for measuring electromagnetic wave shielding effect (the KEC method).
Results
30MHz
100MHz
300MHz
Shielding effect under an electric field
73
69
50
Shielding effect under a magnetic field
68
78
83
2. Bonding strength at different temperatures (180°peeling)
[Left at RT for one hour and aged under each test condition before measurement]
Results
4. Bonding strength after heat cycle test (180°peeling)
Test Piece Condition
Tape width:
20mm
Bonding condition:
One stroke with 2-kg roller
Peel speed:
300mm/min
[A test specimen was left at RT for one hour, and a heat cycle test was conducted under the following conditions. -20°C x 3 hrs ⇔ 25°C x 15 min ⇔ 70°C x 3 hrs⇔ 25°C x 15 min
These conditions comprise one cycle. One to three cycles were conducted for each specimen.]
The technical data in this document, which was acquired based on reliable tests, does not guarantee full performance as per the documentation in any instance. Users assume total responsibility and risk for use of this product for any purpose under any usage conditions.